Materials And Processes For Innovative Manufacturing

Resin Designs TechFilm B-Staged Epoxy Film Adhesives

B-stage epoxy film adhesives are an attractive alternative to liquid adhesives for several reasons:
  • More precise application of adhesive with less waste.
  • Controlled bond line thickness.
  • “Pick-and-place” process instead of dispensing.
  • Better suited for complex designs or large areas requiring accurate placement of adhesive.
  • Ability to stage application of adhesive to component at a different time and/or place from final assembly and cure.
In most cases the optimum cure temperature is 150°C. In the tables we have listed the minimum cure temperature for each material. Some products can cure as low as 90°C.

We can provide these films as preforms cut to the specification of a customer drawing or as sheets or rolls. They are supplied on release liners of smooth wax paper or coated polyester. All products are made by Resin Designs, LLC at their plant just outside of Boston, Massachusetts.

Sheet samples are available on request. Click on product number to download technical data sheet.

Pure Bonding

For maximum bond strength, the unfilled epoxy films listed here are the best choice. They are available in thicknesses from 1 to 4 mils (25 µm to 100 µm). They can also be provided with carriers such as fiberglass, Kapton® polyimide, or Mylar® polyester in the middle of the film or on one side.
Product Minimum Cure
Temperature (°C)
Glass Transition
Temperature (°C)
Features
TechFilm I2202F 115 118 Superior adhesion to metals, including gold, ceramics, and many plastics.
TechFilm I2300F 180 190 Best for high temperature applications and solvent resistance.
TechFilm I2301F 180 190 Low flow version of I2300F designed for digital printing applications requiring ink resistance.
TechFilm I2500F 130 135 Long work life and excellent adhesion to many materials.
TechFilm I2701F 90 110 Lowest cure temperature epoxy film, best for sensitive applications such as bonding piezoelectric devices.

Bonding + Thermal Conductivity

The addition of alumina ceramic or aluminum metal powder fillers to b-staged epoxy films increases their thermal conductivity, important for transporting heat in many electronic assemblies. Aluminum provides the highest performance in this regard, but it turns the bond into an electrical resistor, which may be a detriment in some applications. Alumina preserves high electrical resistance with slightly lower thermal performance. These fillers also improve handling, making the films easier to see and adding some robustness. The standard thickness range is 2 - 5 mils (50 µm - 125 µm), although thicker films can be made. They can also be provided with carriers such as fiberglass, Kapton® polyimide, or Mylar® polyester in the middle of the film or on one side.
Product Minimum Cure
Temperature (°C)
Glass Transition
Temperature (°C)
Filler / Features
TechFilm T2122F 90 81 Alumina / Urethane modified epoxy best suited for bonding plastics as well as metals and ceramics.
TechFilm T2222F 115 112 Alumina / Widely used "go-to" adhesive suitable for bonding many materials.
TechFilm T2321F 180 205 Alumina / High modulus adhesive excellent for high temperature or severe environment applications.
TechFilm T2321XF 180 205 Alumina / Low ionics content version of T2321F.
TechFilm T2381F 180 205 Aluminum / Thermal conductivity of 1.2 W/mK combined with electrical resistance that provides shielding or grounding functionality.
TechFilm T2422F 110 93 Alumina / Rubber modified epoxy offers more flexibility for bonding TCE mismatched materials.
TechFilm T2521F 130 130 Alumina / Easy to work with material offers great combination of thermal conductivity, chemical resistance and long work life.
TechFilm T2581F 130 140 Aluminum / Metal filler provides excellent thermal conductivity along with shielding or grounding functionality.
TechFilm T2723F 90 98 Alumina / Low cure temperature adhesive best suited for sensitive bonding applications.
TechFilm T2781F 100 101 Aluminum / Highest thermal conductivity of this group at 2.6 W/mK.

Bonding + Electrical and Thermal Conductivity

Silver filled epoxy film is the material of choice when high electrical conductivity is required. These products are widely used for bonding circuit boards or hybrids to ground planes. As an added bonus, silver is an excellent conductor of heat and will help with thermal management.
Product Minimum Cure
Temperature (°C)
Glass Transition
Temperature (°C)
Filler / Features
TechFilm E2213F 130 108 Silver / Widely used conductive film provides excellent bonding and grounding properties.
TechFilm E2214F 130 106 Silver / Low ionics version of E2213F that meets MIL-STD 883, Method 5011.
TechFilm E2313F 180 180 Silver / Best choice for high temperature, severe environment applications.
TechFilm E2514F 130 115 Silver / Forgiving, easy to work with material that has long work life.
TechFilm E2713F 90 107 Silver / Lowest cure temperature conductive film has excellent adhesion to gold.
TechFilm E2771F 110 114 Graphite and Carbon Mesh Support / Unique composite film is low cost alternative for shielding and grounding applications.

Request Samples and/or Quote With This Form